Source: International Business Times
The company framed the development as part of a broader effort to strengthen China's domestic semiconductor supply chain amid ongoing technology controls imposed by Washington. Huawei Huawei has said it has developed a new chip design approach it claims could help it achieve cutting-edge semiconductor performance within five years, marking a notable development in China's push for technological self-reliance under continued US export restrictions. At a semiconductor industry conference in Shanghai, Huawei described a shift away from traditional transistor miniaturization toward a stacked architecture approach designed to bypass reliance on extreme ultraviolet lithography equipment that remains restricted under US sanctions introduced in 2019.
